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2nd International Aerospace technology Fair
Business Matching
  • Exhibitor Information
  • Exhibitor Information

    IM Tech Plus Inc.

    Company Info

    CEO Byeongwoo Cho
    Address (10844) Republic of Korea Paju-si, Gyeonggi-do 274-43, LG-ro, Wollong-myeon
    Tel 031-8071-2581 Fax
    Homepage http://www.im-techplus.com/

    Product Info

    Product 1
    DRAM(HBM) HTCC STF
    Material : Al₂O₃ / Al₆Si₂O₁₃
    Layer : ≤ 40
    Size : ≤ 12\\\"
    PI : 1~4 Layer
    Thin Film :
    Ti/Cu/Ni/Au (Outer)
    Mo (Inner)
    Option : Heater
    Product 2
    DRAM(DDR/LPDDR) HTCC STF
    Material : Al2O3 / Al6Si2O13
    Layer : ≤ 40
    Size : ≤ 12\\\"
    PI : 1~4 Layer
    Thin Film :
    Ti/Cu/Ni/Au (Outer)
    Mo (Inner)
    Product 3
    CIS HTCC STF
    Material : Al2O3 / Al6Si2O13
    Layer : ≤ 60
    Size : ≤ 7.5\\\"
    APS Hole Size : 3 ~ 27 mm
    Thin Film :
    Ti/Cu/Ni/Au (Outer)
    Mo (Inner)

    Company Info

    Probe Card\\\'s main raw material ceramic substrate (MLC) manufacturer used in post-semiconductor processing

    Company Profile

    Probe Card\\\'s main raw material ceramic substrate (MLC) manufacturer used in post-semiconductor processing

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